PackSpeed
Specialists in blister packaging solutions

MISSION • To contribute new solutions to blister packaging. To provide solutions for new needs both for companies that are already users of blister packaging as well as for new clients, regardless of the scale of their production, for whom 20th Century blister techniques are now inadequate because of services, costs and initial investment.

PURPOSE • To offer low cost blister systems in narrow band and to have many small and medium-sized firms have access to blister packaging as a packaging solution.
To carry out our own developments in the innovative range of blister packaging technology, so we can do more and better business, with the necessary resources, without any waste of time, materials or money.

HISTORY • In the year 2000 we started our activity in the packaging world, introducing the High Tech Blister. We have devoted more than ten years to Research + Development + Innovation "as a solution to existing and future needs" in the field of Thermoformed Packaging + Sealing + Die Casting = Blister Packaging.
Throughout our history we achieved high profitability by the development of specialised technology and differential knowledge, obtaining patents to our unique processes and developments in the packaging market.